DS Navcours

사업장 소개

공정명	장비/시설	주요사양
Fast Chip Mounter	DECAN F2	Mounting Capability : 0.045sec/Chip (80,000CPH) / 10 Spindle * 2 Gentry Applicable PCB : Max 510㎜ X 460㎜ (Dual Lane) Applicable Components : 0402 ~ 16㎜
Multi Mounter	DECAN L2	Mounting Capability : 0.065sec/Chip (56,000CPH) / 6 Spindle * 2 Gentry Applicable PCB : Max 510㎜ X 460㎜ (Dual Lane) Applicable Components : 0402 ~ 55㎜
AOI	5K-SPECTRO	Applicable PCB : Max 533㎜ X 610㎜ / Camera : 8 M Pixel, 12 bits CCD Inspection resolution (Sub-pixel technology) : 4.75㎛
Reflow	Heller 1809MKIII	Heat 9 Zone, Cooling 2 Zone Air/Nitrogen is heated and circulated.

System Cert. + Operators Cert. + Standards

공정 인증 :
AS9100, NADCAP(AC7120), ANSI/ESD S20.20, DQMS
작업자 인증 :
J-STD-001, IPC-610, SCA , Honeywell Certification
적용 규격 :
J-STD-001,002, 003, 004, 005, 006, 020, 033, IPC-A-610, IPC-7711/7721, MIL-STD etc.